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  6. 5SMY 86M1721

5SMY 86M1721

Picture of 5SMY 86M1721
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Symbol Notation Guide
Technical Data Sheet
Part Numbering Structure
Data Sheet 5SMY12M1721.pdf
Type SPT+
Size A x B 13.6 x 13.6 mm
Thickness 209 µm
VCES 1700 V
IC 150 A
Max. dies per wafer (W) or tray (T) 69 (W)
Product Type IGBT Dies
Size A 13.6 mm
Size B 13.6 mm
ICM 300 A
VCEsat 3.0 V
  • Please consult factory for lower current rating 1200V and 1700V IGBT SPT+ chips.
  • Please consult factory for lower current rating 1200V and 1700V IGBT SPT+ chips.