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Hi Pack IGBTs

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Picture for category IGBT Hipak Modules
IGBT Hipak Modules

  • High power, industry standard package.
  • Designed for high reliability.
  • Aluminum Silicon Carbide base plate for high power cycling.
  • Aluminum Nitride substrates for low thermal resistance.
  • Designed for very high SOA (Safe Operating Area).
  • Low conduction and switching losses.
  • Smooth switching characteristics for good EMC.